Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling

0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.08.017 ⇑ Corresponding author at: STMicroelectronics, 16 7155, 37071 Tours Cedex 2, France. Tel.: +33 (0)2 47 01 34. E-mail address: [email protected] (S. Jacqu In this paper, a physical model is proposed to estimate the TRIAC solder joint fatigue during power cycling. The lifetime prediction is based on the following assumptions: the case temperature swing (DTcase) is the main acceleration factor, the solder joints are the weakest materials in the non-insulated TO-220AB TRIAC package and the plastic strain within the solder layer due to shearing is the failure cause. 2011 Elsevier Ltd. All rights reserved.